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TF1800 BGA and SMD Rework System Procedure

This SOP outlines the procedure for safely setting up, operating, and maintaining the TF-1800 Rework Stations, ensuring consistent performance in component installation and removal processes.
Conestoga College - SMART Centre
10/09/2024

TF1800 BGA and SMD Rework System Procedure

This SOP outlines the procedure for safely setting up, operating, and maintaining the TF-1800 Rework Stations, ensuring consistent performance in component installation and removal processes.

    Do not touch heaters or accessories during operation to avoid burns. Allow the system to cool down before touching after powering off. Ensure adequate ventilation or use fume extraction equipment. Avoid operation near combustible vapors or materials. Do not leave the equipment unattended while powered on. Disconnect the main power cable before opening the rear access door or performing any maintenance.

    Ensure all connections are secure. Switch on the circuit breaker on the back of the TF unit. Power on the PC and monitor. Turn on the machine using the front switch.

    Setup Procedure

    Choose the smallest vacuum pick capable of handling the component. Insert the vacuum pick by hand without using tools to avoid damage.

    Select a nozzle 3mm larger than the component for optimal airflow. Attach the nozzle securely to the underside of the heater head.

    Switch on the circuit breaker at the back of the TF machine. Power on the PC and monitor. Turn on the machine using the front power switch. Once the PC boots up, open the TF software.

    For machine malfunctions or abnormal operation, refer to the Debug Screen on the TF software. Use the Setup Commands to perform specific tests or reset machine functions, and the Status Request Commands to verify system status. For further information refer to the manual attached.

    Operating Procedure

    Power on the TF machine and PC, then launch the TF software. Load the appropriate profile using the Load Profile button. Install the correct vacuum pick and nozzle. Place the PCB in the board holder, align the red laser with the component placement site, and tighten the retention screw. Apply flux and attach any thermocouples if required. Position the component on the camera housing, ensuring proper orientation. The machine will automatically pick up the component. If the vacuum fails, reposition the component and retry. Align the component to the PCB using the zoom and X/Y micrometers. Complete the alignment, then start the heating process. Once heating is complete, allow the PCB to cool before removal.

    Load the appropriate removal profile using the Load Profile button. Install the correct vacuum pick and nozzle. Place the PCB in the board holder and center the laser on the component. Click Start Process and follow the prompts for removal. Allow the component and PCB to cool before handling.

    Maintenance

    Clean and lightly lubricate the horizontal rails of the board holder daily with ISOVG32 oil. Lubricate the vertical rails annually using ISOVG220 grease. Vacuum pick bearings should be cleaned and lubricated annually using NLGI Grade 2 lubricant.

    Check and clean the VisiFilter (located at the rear door) as needed to maintain airflow.

Source: Conestoga College - SMART Centre (Community Member)

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